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NTD20N06, NTDV20N06
Power MOSFET
20 Amps, 60 Volts, N ? Channel DPAK
Designed for low voltage, high speed switching applications in power
supplies, converters and power motor controls and bridge circuits.
Features
? Lower R DS(on)
? Lower V DS(on)
? Lower Capacitances
? Lower Total Gate Charge
? Lower and Tighter V SD
? Lower Diode Reverse Recovery Time
? Lower Reverse Recovery Stored Charge
? AEC Q101 Qualified ? NTDV20N06
? These Devices are Pb ? Free and are RoHS Compliant
V (BR)DSS
60 V
http://onsemi.com
R DS(on) TYP
37.5 m W
N ? Channel
D
I D MAX
20 A
Typical Applications
? Power Supplies
? Converters
? Power Motor Controls
? Bridge Circuits
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
S
MARKING
DIAGRAM
Rating
Drain ? to ? Source Voltage
Symbol
V DSS
Value
60
Unit
Vdc
4
Drain
Drain ? to ? Gate Voltage (R GS = 10 M W )
Gate ? to ? Source Voltage
? Continuous
? Non ? repetitive (t p v 10 ms)
Drain Current
? Continuous @ T A = 25 ° C
? Continuous @ T A = 100 ° C
? Single Pulse (t p v 10 m s)
V DGR
V GS
V GS
I D
I D
I DM
60
" 20
" 30
20
10
60
Vdc
Vdc
Adc
Apk
1 2
3
4
DPAK
CASE 369C
STYLE 2
1
Gate
2
Drain
3
Source
Total Power Dissipation @ T A = 25 ° C
Derate above 25 ° C
Total Power Dissipation @ T A = 25 ° C (Note 1)
Total Power Dissipation @ T A = 25 ° C (Note 2)
Operating and Storage Temperature Range
P D
T J , T stg
60
0.40
1.88
1.36
? 55 to
175
W
W/ ° C
W
W
° C
20N06
Y
WW
G
= Device Code
= Year
= Work Week
= Pb ? Free Package
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 25 Vdc, V GS = 10 Vdc,
L = 1.0 mH, I L (pk) = 18.4 A, V DS = 60 Vdc)
Thermal Resistance
? Junction ? to ? Case
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
E AS
R q JC
R q JA
R q JA
T L
170
2.5
80
110
260
mJ
° C/W
° C
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using the minimum recommended
pad size.
2. When surface mounted to an FR4 board using the 0.5 sq in drain pad size.
? Semiconductor Components Industries, LLC, 2011
August, 2011 ? Rev. 8
1
Publication Order Number:
NTD20N06/D
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